08—09 April 2027   /   MalaysiaIconic Marjorie Hotel · Penang
FromSemiconductorto AI.

Semiconductor Asia Summit Malaysia 2027

Architecting the Future of ASEAN’s Chip Ecosystem

Penang waterfront, bridge and semiconductor wafer artwork from the summit brochure
One region. A world of opportunity.Discover the summit
300+C-level delegates
100+Semiconductor organisations
40+Speakers / panelists
10+Countries represented
20+Partners & endorsers
15+Upcoming projects
01 / The opportunity

Powering AI
from Southeast Asia.

Semiconductor Asia Summit Malaysia 2027 brings government authorities, investors, semiconductor manufacturers, chip designers and technology partners together in Penang to explore the region’s next phase of growth.

Rising demand for AI computing is opening opportunities across design, wafer fabrication, advanced packaging, memory, power devices and manufacturing. This is where the investments, technologies and partnerships come together.

About the summit

Across two days, 40+ semiconductor leaders and disruptors will discuss how to expand manufacturing capacity, strengthen regional supply chains, develop commercially viable chip products and improve factory performance through AI and automation. Sessions also address skilled talent, reliable infrastructure, supplier qualification, access to capital and cross-border cooperation.

Designed as a focused B2B platform, the summit combines executive discussions, project presentations, technology showcases and pre-arranged business meetings. Government and investment agencies engage with industry leaders, while manufacturers and project owners meet suppliers offering solutions to specific operational and expansion needs.

02 / The people shaping what’s next

Industry voices.
Real perspective.

Meet a sample of our 2026 event speakers.
Previous speakers and invited organisations are shown separately. The 2027 line-up is to be confirmed.

Susan Goh

Susan Goh

Group VP Central Materials Engineering

STMicroelectronics
J Wing Teh

J Wing Teh

Director of Silicon Design Engineering

AMD
Dr. Ranee Ramya

Dr. Ranee Ramya

Country Manager, Malaysia

IPC International Inc.
Dr Oh Ser Wah

Dr Oh Ser Wah

General Manager

Hanic TecH
Soon Lee Yeap

Soon Lee Yeap

Executive Vice President

Oppstar Berhad
Dato’ Loo

Dato’ Loo

CEO

InvestPenang
View all 18 featured 2026 speakers
Angel Low

Angel Low

General Manager

Advanced Semiconductor Academy of Malaysia (ASEM)
Khai Lik

Khai Lik

Senior Manager, Silicon Design

AMD
Dr. Angie See Tien Ng

Dr. Angie See Tien Ng

AI Principal Engineer, Tech Director

Intel
Yet Foon J Lai

Yet Foon J Lai

Sr. Director, Hardware Design Engineering

Intel
Dominic Koey

Dominic Koey

Technical Director, Package Innovation

NXP Semiconductors
Dr. Chin Seong Lim

Dr. Chin Seong Lim

Director & Head, Electrical & Electronic Engineering

University of Nottingham Malaysia
J. Phillip Vincent

J. Phillip Vincent

Special Advisor to Deputy Chief Minister II

Penang
Chian Min Liong

Chian Min Liong

Managing Director

Renesas
Jen Sen Yang

Jen Sen Yang

Managing Director

Altera Malaysia
Thung Beng Joo

Thung Beng Joo

Vice President

SilTerra Malaysia
Yvonne Keil

Yvonne Keil

Sr. Director GFES Operations Malaysia & India

GlobalFoundries
Tan Chun Chiat

Tan Chun Chiat

COO

Oppstar Bhd

Invited attendees

Connecting semiconductor manufacturers, investors and public agencies across Southeast Asia. Participation is subject to confirmation.

Marked organisations appear on the brochure’s invitation list. Other logos represent the regional ecosystem.

03 / More than a conference

Ideas meet
opportunity.

Your one-stop platform connecting Southeast Asia’s semiconductor leaders.

Explore market opportunitiesGain actionable insightsBuild strategic partnerships
04 / The programme

Conference Agenda

From the AI opportunity to competitive factories and supply chains.

DAY 01

Winning the AI Semiconductor Opportunity

  1. Registration & Morning Coffee
  2. Opening Remark — Event Chairman
  3. Government Keynote — Malaysia Semiconductor Strategy 2027: From Investment to Global Leadership
  4. Keynote — The $1 Trillion Semiconductor Race: Where Southeast Asia Can Win
  5. Panel Discussion 1 — Beyond OSAT: Who Captures the Next Wave of Advanced Packaging Value?
  6. Keynote — HBM and Advanced Packaging: The Regional Opportunity (Reserved for Event Partner)
  7. Tech Session — Advanced Test for AI Chips: HBM, Chiplets and High-Power Devices (Reserved for Event Partner)
  8. Networking — AM Tea Break + Speed Networking
  9. Panel Discussion 2 — From IC Design to Malaysian-Owned Chips: Can Southeast Asia Build Semiconductor Champions?
  10. Tech Session — Chiplets & Heterogeneous Integration: The New Architecture of AI (Reserved for Event Partner)
  11. Lunch Break + Networking
  12. Panel Discussion 3 — One ASEAN Semiconductor Value Chain: Can Southeast Asia Compete as One Ecosystem?
  13. Tech Session — Silicon Photonics: Connecting the AI Data Center (Reserved for Event Partner)
  14. Tech Session — Thermal Management: Cooling the Next Generation of High-Power Chips (Reserved for Event Partner)
  15. Networking — PM Tea Break + Speed Networking
  16. Panel Discussion 4 — Who Pays for the Next Fab? Financing Semiconductor Expansion in Southeast Asia
  17. Panel Discussion 5 — The Next Semiconductor Battleground: Which Products Should Southeast Asia Build?
  18. Lucky Draw + Closing Remarks
  19. End of the Event
  20. Private Dinner — Open for sponsorship (contact cassie.mei@escom-events.com)
DAY 02

Building Competitive Factories and Supply Chains

  1. Registration & Morning Coffee
  2. Opening Remarks — Event Chairman
  3. Government Keynote — Building Malaysia’s Next Semiconductor Growth Clusters
  4. Keynote — Power & Specialty Chips: Growth Beyond AI Accelerators
  5. Panel Discussion 1 — From Local Supplier to Global Tier 1: Winning Semiconductor Qualification
  6. Keynote — Ramping New Capacity: From Installed Tools to Qualified Output (Reserved for Event Partner)
  7. Presentation — Advanced Inspection: Finding Defects Before Yield Is Lost (Reserved for Event Partner)
  8. Networking — AM Tea Break + Speed Networking
  9. Panel Discussion 2 — Power Semiconductors: Can Southeast Asia Win the SiC & GaN Race?
  10. Tech Session — AI Inside the Fab: Autonomous Manufacturing, Digital Twins & Predictive Yield (Reserved for Event Partner)
  11. Lunch Break + Networking
  12. Panel Discussion 3 — The Fab Resource Race: Power, Water, Carbon & Resilience
  13. Tech Session — Precision Automation for High-Mix Semiconductor Manufacturing (Reserved for Event Partner)
  14. Tech Session — Smart Factory Infrastructure: Building for Automation, AI & Scale (Reserved for Event Partner)
  15. Networking — PM Tea Break + Speed Networking
  16. Panel Discussion 4 — The Semiconductor Talent War: Building the Workforce of 2030
  17. Panel Discussion 5 — From Pilot Line to High-Volume Production: Winning the Yield and Ramp-Up Race
  18. Lucky Draw + Closing Remarks
  19. End of the Event
  20. Private Dinner — Open for sponsorship (contact cassie.mei@escom-events.com)

All times are local to Penang, Malaysia (MYT / UTC+8).

05 / Your next connection

One ecosystem.
Many possibilities.

A focused B2B audience spanning policy, capital, manufacturing, technology and investment.

Delegate demographics

Regional profile presented in the event brochure

69.5%Malaysia
Singapore9%
Taiwan, China6%
Mainland China5%
South Korea3%
Japan2%
Vietnam1%
Thailand1%
Philippines1%
North America1%
India0.5%
Indonesia0.5%
Rest of the world0.5%

Decision-makers in the room

  • Managing Director, Country GM, CEO, Founder
  • Plant Manager, Fab Director
  • Head of Manufacturing & Operations
  • Procurement / Sourcing Head
  • Engineering / Technology Director
  • Capital Projects / Expansion Director
  • Supply Chain Head
  • Investment Director
  • Technology Experts
  • Others
Explore the business profiles
  • Government & Regulatory Authorities
  • Investment Promotion & Economic Development Agencies
  • Investment Funds & Institutional Investors
  • Integrated Device Manufacturers (IDMs)
  • Semiconductor Wafer Foundries
  • Fabless Semiconductor Companies
  • Memory & Storage Semiconductor Manufacturers
  • Power, Analog & Mixed-Signal Semiconductor Companies
  • Optoelectronic & Sensor Semiconductor Companies
  • Semiconductor Project Owners & Developers
  • AI Infrastructure Owners & Operators
  • Industry Associations & Research Institutions
  • Solution Providers & Technology Partners
2026 event attendees

A community across the value chain.

AMDIntelNVIDIAInfineonSTMicroelectronicsMicronBroadcomASE

A selection of organisations on the 2026 attendee list. Past participation does not indicate a 2027 commitment.

Explore the complete 2026 attendee list
  • 2V Systems
  • AccoTEST
  • Advance Semiconductor
  • Advanced Semiconductor Academy of Malaysia (ASEM)
  • Advantek
  • Advinno Technologies
  • ALC-Tech
  • Alliance Islamic Bank
  • Altera
  • AMD
  • Amkor Technology
  • ams OSRAM
  • Analog Devices
  • ASE Technology
  • Asec Tech
  • Astrodyne
  • Attractive Venture
  • Automated Micron Assembly
  • Be Wonderful — IC Training
  • BlueChip VC
  • Bondtek
  • Broadcom
  • Bursa Malaysia
  • Bymetrix
  • Cadence
  • Carsem
  • Chengdu Homin Technology
  • CIMB Bank
  • Coherent
  • ComRel Technologies
  • Connexus
  • Coraza Systems
  • CREST
  • Critical Manufacturing
  • D’nonce
  • Dell Technologies
  • DFStar Technology
  • DOST-PCIEERD
  • Dr Laser
  • ECA Advanced Solutions
  • Embassy of Spain in Malaysia
  • Embassy of the Kingdom of the Netherlands in Malaysia
  • Enovate3D
  • Epicor
  • Estek Automation
  • Evatec
  • Exentec
  • EY
  • Fin Fab Tech
  • FM Global
  • Gaia Science
  • Global Electronics Association
  • Global LanceSoft
  • GPI Technology
  • Greatech
  • GSH Precision Technology
  • GTECH Asia
  • Hakko Products
  • Hanic
  • Hitachi High-Tech
  • Hong Leong Bank
  • HYC
  • ib vogt
  • Inari Amertron
  • Infineon Technologies
  • Intel
  • InvestPenang
  • Jabil
  • JEM SE Asia
  • JKS Engineering
  • Johnstech International
  • K-One Industry
  • Kaltech
  • Kaynes Semicon
  • Keysight Technologies
  • Kisco
  • KriSemi Design Technologies
  • KuasaSemi
  • Lanco Integrated
  • Lattice Semiconductor
  • LGI Technology
  • M.E.I. Architects & Engineers
  • MacDermid Alpha Electronics Solutions
  • Mach Technology
  • Magic Ray
  • Malaysia Digital Economy Corporation (MDEC)
  • Malaysia External Trade Development Corporation (MATRADE)
  • Malaysia Semiconductor Industry Association (MSIA)
  • Malaysian Industry-Government Group for High Technology (MIGHT)
  • Malaysian Investment Development Authority (MIDA)
  • Malaysian Technology Development Corporation (MTDC)
  • Malaysian-German Chamber of Commerce and Industry (MGCC)
  • Marsh
  • Merck
  • Mettler Toledo
  • Micro Modular System
  • Micro-Mechanics
  • Microchip Technology
  • Micron Technology
  • MIMOS
  • Ministry of Investment, Trade and Industry (MITI)
  • Motorola Solutions
  • NationGate
  • NAURA
  • Nexperia
  • Nexus Precisions
  • Nexustest
  • Nolek
  • Northern Corridor Implementation Authority (NCIA)
  • Northern Solar
  • NVIDIA
  • NXP Semiconductors
  • OCBC Bank
  • Omdia
  • onsemi
  • Oppstar
  • OSAI
  • Panac Advanced Film
  • Pangaea
  • Penang Green Council
  • Penang Skills Development Centre (PSDC)
  • Pentamaster
  • Percevals
  • Pickering Interfaces
  • Plexus
  • Port of Tanjung Pelepas
  • Precede Precision Engineering
  • PREM
  • QES
  • RC Precision Engineering
  • Reid-Ashman Manufacturing
  • Renesas Electronics
  • Rightsilicon Technology
  • Rittal
  • Robert Bosch
  • SanDisk
  • Sembcorp Industries
  • Semiconductor Automation Technologies
  • SESSCO Technologies
  • SFP Tech
  • Shan Poornam Group
  • Shenzhen Vital New Material
  • SignOff Semiconductors
  • SilTerra Malaysia
  • Singapore Economic Development Board (EDB)
  • SIRIM
  • SiyaCon Technologies
  • Sky Global Time Critical Solutions
  • SkyeChip
  • SMD Semiconductor
  • STMicroelectronics
  • Synopsys
  • Talent Corporation Malaysia (TalentCorp)
  • Tapcell
  • Tata Consultancy Services (TCS)
  • Tessolve Semiconductor
  • Texas Instruments
  • TF-AMD
  • Threshing Floor Silicon House
  • ThunderSoft
  • Trelleborg Sealing Solutions
  • TT Vision
  • Turner & Townsend
  • Turner International
  • Unisem
  • United Parcel Service (UPS)
  • Universal Instruments
  • Universiti Sains Malaysia (USM)
  • UST
  • Vchip
  • VisionPower Semiconductor Manufacturing Company (VSMC)
  • Wacker Chemicals
  • WalcomTech
  • Walta Engineering
  • Würth Elektronik
  • X-FAB
06 / Put your business in the conversation

Be part of
the next wave.

Meet decision-makers face to face. Showcase solutions. Build strategic partnerships across the semiconductor ecosystem.

Compare every sponsorship benefit
Sponsorship benefits · *Contact information subject to consent and availability.
BenefitDiamondGoldSilverExhibitor
Branding / promotionIncludedIncludedIncludedIncluded
Attendee wishlistIncludedIncludedIncludedIncluded
Booklet insertion2 pages2 pages1 page1 page
Banner setupIncludedIncludedIncluded—
Speaking slot30 min15 min15 min—
Exhibition booth3 × 2 m3 × 2 m—3 × 2 m
One-on-one private meeting4———
Delegate passes3322
Post-event report & delegate contact listIncluded*Included*Included*Included*
Price / USD$14,900$9,900$6,900$5,900

Dinner sponsor

Host a private dinner in your company’s name with delegates from your wishlist.

Workshop sponsor

Invite selected potential clients to a private, closed-door workshop presentation.

Badge / lanyard / bag sponsor

Place your company logo on event materials to increase brand exposure.

One-on-one meetings sponsor

Conduct private meetings with selected delegates from your wishlist.

Who should sponsor?
07 / Meet us in Penang

A remarkable place
to move forward.

8–9 April 2027
Penang, Malaysia

Grand ballroom at Iconic Marjorie Hotel

Iconic Marjorie Hotel

239A, Jalan Sultan Azlan Shah,
11900 Bayan Lepas, Penang, Malaysia.

A Tribute Portfolio hotel by Marriott International. Peranakan-inspired interiors celebrate Penang’s rich cultural heritage and unique cultural blend, welcoming business and leisure travellers.

Map showing Iconic Marjorie Hotel in Bayan Lepas on Penang Island
08 / Your space to connect

The exhibition.
The connections.

Level 12 · Grand Ballroom
Conference, networking and exhibition spaces, together.

Level 12 Grand Ballroom interactive exhibition planLayout redrawn from the event brochure. A01 to A08 are in the foyer; B01 to B04 are inside the ballroom along its left wall. Hover, tap or use keyboard arrows to explore a booth. The plan does not show booking availability.LEVEL 12 / GRAND BALLROOMPENANG · MALAYSIASTAGEAUDIENCE SEATING50.9 m × 15.24 mCEILING HEIGHT 8.20 mConference seating areaVIP ROOMTea break & buffet lunchRegistrationGuest liftsEXHIBITION FOYERBALLROOM BOOTHSBooth A01 · 6 sqm · Select for detailsA01Booth A02 · 6 sqm · Select for detailsA02Booth A03 · 6 sqm · Select for detailsA03Booth A04 · 6 sqm · Select for detailsA04Booth A05 · 6 sqm · Select for detailsA05Booth A06 · 6 sqm · Select for detailsA06Booth A07 · 6 sqm · Select for detailsA07Booth A08 · 6 sqm · Select for detailsA08Booth B01 · 6 sqm · Select for detailsB01Booth B02 · 6 sqm · Select for detailsB02Booth B03 · 6 sqm · Select for detailsB03Booth B04 · 6 sqm · Select for detailsB04Hover or tap a booth to exploreLayout based on the event brochure · not to scale
Explore all 12 exhibition spaces.

Designed for
face-to-face business.

Position your team alongside the summit’s conference and networking spaces.

Selected exhibition space
A01

Exhibition foyer

3 × 2 m 6 sqm raw space
  • Raw space, electricity and Wi-Fi
  • One desk and chairs provided
  • No shell scheme provided by the organiser
  • Design, construction and tear-down are the exhibitor’s responsibility
Enquire about A01 ↗

Availability and final booth arrangements are confirmed by the organiser.

Illustrative 3 by 2 metre booth design from the brochure

3 × 2 mSample booth design.
Raw space only.

Illustrative 4 by 3 metre booth design from the brochure

4 × 3 mAlternative sample design.
Enquire for arrangements.

Booth images illustrate possible exhibitor-built designs. The hotel provides electricity, chairs and tables as needed; booth construction is not included.

Some of our previous exhibitors
09 / Be in the room

The future of chips.
Starts with a
conversation.

Join the semiconductor leaders, investors and technology partners shaping Southeast Asia’s next chapter.

08–09 April 2027   ·   Iconic Marjorie Hotel, Penang

Scan the official summit registration QR code

See you in Penang.

Scan to register, or get in touch to discuss attendance, speaking and sponsorship.

Enlarged original floor plan: Level 12, Grand Ballroom